MOUNTING PRODUCT, INTERMEDIATE PRODUCT, AND METHODS OF MANUFACTURING THEM

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a mounting product eliminating connection failures and facilitating alignment regardless of a warp or the like of a wiring board or the like in a flip-chip mounting product using junction bumps.

SOLUTION: The method of manufacturing the mounting product in which an electrode 11 of a photo-diode array and an electrode 71 of an ROIC (Read-Out IC) 50 are joined together via the junction bumps 79, 9 includes the step of forming the junction bump 79 on the electrode 71 of the ROIC, and the step of chemical-mechanical-polishing (CMP) the junction bumps 79 on the entire of the ROIC.

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