| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition with which a cured product used for an optical semiconductor sealing material, an adhesive, an electric insulation material, a laminated board, a coating, ink, paint, a sealant, a resist, a composite material, a transparent base material, a transparent sheet, a transparent film, an optical element, an optical lens, an optical member, a photo-farication, electronic paper, a touch panel, a solar battery substrate, an optical waveguide, a light guide plate, a holographic memory, and so on, and which is excellent in heat resistance, light resistance, transparency, and crack resistance, can be formed. <P>SOLUTION: There is provided a curable epoxy resin composition including: (A) an alicyclic epoxy compound; (B) a monoallyl diglycidyl isocyanurate compound represented by formula (1) [wherein R<SB>1</SB>and R<SB>2</SB>are each a hydrogen atom or a 1-8C alkyl group]; and (C) a curing agent or (D) a curing catalyst. <P>COPYRIGHT: (C)2011,JPO&INPIT |
