| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive and an adhesive for circuit connection which exhibit high adhesive strength in spite of a radical curing system, has a stable performance even after a reliability test and is excellent in storage stability, too, and to provide a connected body and a semiconductor device using the adhesive. SOLUTION: The adhesive includes: (a) a thermoplastic resin; (b) a radically polymerizable substance which contains a structure represented by the general formula (B) (in the formula, M denotes an integer of 0 to 10 and N denotes an integer of 1 to 20) and/or formula (C) and has at least two (meth)acryloyl groups and at least two urethane bonds; and (c) a radical polymerization initiator. COPYRIGHT: (C)2011,JPO&INPIT
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