发明名称 |
Apparatus and Method for Defining Laser Cleave Alignment |
摘要 |
An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide.
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申请公布号 |
US2011198731(A1) |
申请公布日期 |
2011.08.18 |
申请号 |
US201113030496 |
申请日期 |
2011.02.18 |
申请人 |
SEAGATE TECHNOLOGY LLC |
发明人 |
HIPWELL ROGER L.;SNYDER TANYA J.;OLSON SCOTT E.;GAGE EDWARD C. |
分类号 |
H01L23/544;H01L21/66 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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