发明名称 BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
摘要 There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.
申请公布号 US2011201207(A1) 申请公布日期 2011.08.18
申请号 US201113077176 申请日期 2011.03.31
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 TSAI YAW-MING A.;STAINER MATTHEW
分类号 H01L21/302;G03F7/20 主分类号 H01L21/302
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