发明名称 CAMERA MODULE AND THE FABRICATING METHOD THEREOF
摘要 PURPOSE: A camera module and manufacturing method thereof are provided to electrically connect a conductive line and a conductive connection unit on the side wall of an image sensor. CONSTITUTION: A plurality of image sensors(130) prepares for a base plate. A via-hole is formed along the line of an image sensor. A pad unit of the image sensor is formed in a plating layer. The base plate is cut along a border line and separated into an image sensor. The separated image sensor is laminated on the substrate.
申请公布号 KR20110093452(A) 申请公布日期 2011.08.18
申请号 KR20100013507 申请日期 2010.02.12
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 CHA, JI BUM;LEE, BYEONG HO
分类号 H04N5/225 主分类号 H04N5/225
代理机构 代理人
主权项
地址