| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method, capable of efficiently manufacturing a reliable wiring board with a reliable conductor pattern, by preventing the occurrence of cracks, disconnections, short circuit, or the like. <P>SOLUTION: The method of manufacturing the wiring board of the present invention includes: a step of preparing a ceramic compact consisting of materials including a ceramic material and binder; a step of forming a conductor pattern precursor by discharging conductor pattern forming ink including metal particles and a dispersion medium that disperses the metal particles by a droplet discharge method, to the ceramic compact; a step of providing composition including dispersion-lowering agents, which lowers the dispersion of the metal particles in the conductor pattern forming ink, at least to a part of the ceramic compact, where the conductor pattern forming ink has been provided; a step of obtaining a laminated body by laminating a plurality of ceramic compacts; and a step of obtaining the wiring board having the conductor pattern and a ceramic substrate by sintering the laminated body. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
