发明名称 LASER BEAM MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device which can form a wide laser beam machined groove, and can perform effective machining along a machining line. <P>SOLUTION: The laser beam machining device includes: a chuck table 36 holding a workpiece W; a laser beam irradiation means 52 emitting a laser beam LB; and a machining feed means relatively moving both of them. The laser beam irradiation means includes: a laser beam oscillation means 53; and a condenser 6 condensing the laser beam. The condenser is constituted of: a laser beam separation means 62 disposed with a plurality of pieces of wavelength plates 621a, 622a producing a phase difference between polarizing components parallel to an optical axis and polarizing components vertical thereto in the laser beam and separators 621 and 622 composed of birefringence type beam splitters 621b, 622b separating the laser beam at a prescribed separation angle in series; and a condenser lens 63 condensing a plurality of laser beams, and the respective birefringence type beam splitters are set so as to have different separation angles. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011156551(A) 申请公布日期 2011.08.18
申请号 JP20100019009 申请日期 2010.01.29
申请人 DISCO ABRASIVE SYST LTD 发明人 NOMARU KEIJI
分类号 B23K26/067;B23K26/00;B23K26/06;H01L21/301 主分类号 B23K26/067
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