| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste and a method of manufacturing a ceramic multilayer circuit board, which enables high definition printing without an influence on the diameter of a secondary particle of conductor powder in the conductive paste and can provide the ceramic multilayer circuit board having a minimized warpage during baking. SOLUTION: The method of manufacturing the ceramic multilayer circuit board includes a step of forming wiring by baking the conductive paste, wherein the conductive paste used in the step of forming the wiring contains a conductor and a dispersant, a content of the conductor is 60-90 wt.% based on the total weight of the conductive paste, the content of the dispersant to the conductor is 0.1-3.0 wt.%, and the conductor forms a secondary agglomerate body in the conductive paste. COPYRIGHT: (C)2011,JPO&INPIT |
