| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a die bonding dicing sheet which can peel off and remove an unnecessary portion without cutting off an adhesive layer or an adhesive film when removing the unnecessary portion of the adhesive layer or the adhesive film,. SOLUTION: The method for manufacturing the die bonding dicing sheet includes at least one process out of a process which, when removing an adhesive layer 32, performs cooling processing for the adhesive layer corresponding to a gap formed between the adhesive layer and a wafer-shaped adhesive layer adjacent to the adhesive layer in a longitudinal direction and/or performs heating processing for an adhesive layer adjacent to the narrowest portion which is located on an extension line of a diameter of a circular adhesive layer parallel with the width direction of a peeling base material 31 and having a minimum width size, and a process which, when removing an adhesive film 33, performs cooling processing for the adhesive film corresponding to a gap portion formed between the adhesive film and a circular adhesive film adjacent to the adhesive film in a longitudinal direction and/or performs heating processing for the adhesive film adjacent to the narrowest portion located on an extension line of a diameter of the circular adhesive film parallel with the width direction of the peeling base material 31 and having the minimum width size. COPYRIGHT: (C)2011,JPO&INPIT |
