发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a semiconductor device and a method for manufacturing the same, with the semiconductor device having a partial separating body fixing SOI structure aimed at reducing the body resistance. SOLUTION: When the source, drain regions are formed in an NMOS transistor, an N-type impurity is avoided to be injected into a well region 11 under a gate direction extended region 41a by the gate direction extended region 41a of an N<SP>+</SP>-block region 41 in an N<SP>+</SP>-block resist 51. A high-resistance forming region in the well region 11, having a risk of being implanted with an N-type impurity in a gate electrode 9 longer direction extended line, is a high-resistance forming region A2, that is narrower than a conventional high resistance forming region A1. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011159990(A) 申请公布日期 2011.08.18
申请号 JP20110079819 申请日期 2011.03.31
申请人 RENESAS ELECTRONICS CORP 发明人 MAEDA SHIGENOBU;IWAMATSU TOSHIAKI;IPPOSHI TAKASHI
分类号 H01L29/786;H01L21/76;H01L21/8238;H01L27/08;H01L27/092 主分类号 H01L29/786
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