| 摘要 |
PROBLEM TO BE SOLVED: To prevent dew from being formed on a surface of a glass plate in a solid-state imaging apparatus. SOLUTION: The solid-state imaging apparatus includes a package 1 having a recess 1a formed atop and also having metal leads 2, a frame-shaped package rib 3 fixed on an upper surface of the package 1, a solid-state imaging element 5 fixed to the recess 1a of the package 1 and having electrode pads 6, thin metallic wires 7 electrically connecting the metal leads 2 and electrode pads 6 to each other, and a glass plate 9 fixed to an upper surface of the package rib 3 with an adhesive 8. A first groove is formed on the top of the package rib 3. A slit 8a is formed in the adhesive 8 at a part corresponding to the first groove. Through the slit 8a, a space S formed of the package rib 3 and the glass plate 9 fixed to the package rib 3 with the adhesive 8 communicates with the outside. COPYRIGHT: (C)2011,JPO&INPIT
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