| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film combining high adhesion force in low-temperature and short-time conditions and excellent conduction reliability, and also to provide a bonded body using the anisotropic conductive film, and a bonding method. <P>SOLUTION: The anisotropic conductive film 12 has at least: a conductive layer 21; and an insulating layer 22. The insulating layer 22 contains: a binder;, a monofunctional polymerizable monomer; and a curing agent. The conductive layer 21 contains Ni particles, metal-coated resin particles 12a, a binder, a polymerizable monomer and a curing agent. The metal-coated resin particles 12a are resin particles formed by coating a resin core with at least Ni. The insulating layer 22 preferably contains at least phenoxy resin, a monofunctional (meth)acrylic monomer and organic peroxide. <P>COPYRIGHT: (C)2011,JPO&INPIT |
