| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide ink for conductor pattern formation, which can be stably ejected from a droplet ejection head and can prevent defective conduction from occurring on a formed conductor pattern, to provide the conductor pattern having high reliability, and to provide a wiring board which is provided with such a conductor pattern and has high reliability. <P>SOLUTION: The conductor pattern formation ink is the one for forming the conductor pattern on a substrate according to a droplet ejection method, and includes: metal particles; an aqueous dispersant in which the metal particles are dispersed; a compound represented by the formula (I) (wherein, R, R' are each H or alkyl); and a compound represented by the formula (II) (wherein, R'', R''' are each H or alkyl). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
