发明名称 |
METHOD AND DEVICE FOR INSPECTING PATTERN DEFECTS |
摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein a large charged potential may generate large contrast disorder on electron image formation since a charged distribution with a large potential may be generated on the whole wafer in a certain process of semiconductor manufacturing processes. SOLUTION: In an inspection method for pattern defects, when the wafer is conveyed from a reserve chamber 202 to a vacuum chamber 201, the charge of the wafer generated in advance is eliminated by using a precharge removing device 1201, or is decreased to a potential which can be controlled with precharging performed at the time of inspection. It is preferable that an installing position of the precharge removing device 1201 is at a vacuum chamber 201 side of an opening between the reserve chamber 202 and the vacuum chamber 201. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011159636(A) |
申请公布日期 |
2011.08.18 |
申请号 |
JP20110105815 |
申请日期 |
2011.05.11 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
HASEGAWA MASAKI;MAKINO HIROSHI;KOYAMA HIKARI;TEI TOMOKI;MURAKOSHI HISAYA |
分类号 |
H01J37/20;H01J37/29;H01L21/66 |
主分类号 |
H01J37/20 |
代理机构 |
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地址 |
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