| 摘要 |
A method of manufacturing a semiconductor device includes preparing a flexible printed wiring board having a first connection pad formed on a front surface, a second connection pad formed on a back surface, and a coating film covering regions of the flexible printed wiring board where the first and second connection pads are formed, and a semiconductor package having a third connection pad formed on a hack surface; mounting the semiconductor package on the front surface of the flexible printed wiring board so that the third connection pad is connected to the first connection pad; and folding the flexible printed wiring board so that the second connection pad is located above the front surface of the semiconductor package to face in the same direction as a front surface of the semiconductor package.
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