| 摘要 |
A metal-embedded substrate includes a core layer having first circuit wiring lines with bond fingers formed on a first surface of the core layer and second circuit wiring lines with ball lands formed on a second surface of the core layer. Via wiring lines are formed so as to pass through the core layer and connect the first and second circuit wiring lines. Solder masks are selectively formed on the first and second surfaces of the core layer, including the first and second circuit wiring lines, so as to expose the bond fingers and the ball lands. Metal patterns are formed on the ball lands exposed through the solder masks. A metal active material is formed on the solder mask formed on the second surface of the core layer, and covers side surfaces of the metal patterns.
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