发明名称 SUBSTRATE LOAD AND UNLOAD MECHANISMS FOR HIGH THROUGHPUT
摘要 In various exemplary embodiments described herein, a system includes a plurality of carrier arms each having concentrically mounted midpoints between opposing ends of the carrier arms with a wafer carrier mounted on each of the opposing ends of the carrier arms. A hub includes a plurality of concentrically mounted drives where each of the plurality of drives is coupled near the midpoint of a respective one of the plurality of carrier arms. Each of the plurality of drives is configured to be controlled independently of the remaining plurality of concentrically mounted drives. A respective motor is coupled to each of the concentrically mounted drives and is configured to move the coupled carrier arm in a rotary manner. A linear wafer transport mechanism moves wafers to or from select ones of the wafer carriers on the plurality of carrier arms to an easy handoff location for a load/unload robot.
申请公布号 US2011200415(A1) 申请公布日期 2011.08.18
申请号 US20100706397 申请日期 2010.02.16
申请人 LAM RESEARCH CORPORATION 发明人 LENZ ERIC H.
分类号 H01L21/673;H01L21/677 主分类号 H01L21/673
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