| 摘要 |
The present invention relates to an apparatus (100) for washing a workpiece such as wafers, PC boards, hybrid circuits, precision mechanical or electromechanical components, optical instruments, medical devices or the like. Preferably, the apparatus (100) of the present invention can be used for washing disk drive components that have a substantially flat disc shape. The simple and easy to maintain structure of the present apparatus provides an uni-directional flow of washing liquid within the apparatus to remove contaminants from the surface of a workpiece in a submerged condition under streams of the washing liquid. The uni-directional flow of the washing liquid is achieved via a means which pumping a flow of washing liquid into the inlet and simultaneously extracting a flow of washing liquid out of the outlet of the apparatus (100). The uni-directional flow of the washing liquid is capable of preventing the removed contaminants from re-depositing onto the surface of the workpiece that has been cleaned. |
