| 摘要 |
PURPOSE: A heat discharge printed circuit board and a manufacturing method thereof are provided to discharge heat from a semiconductor chip in various directions by forming a thermally conductive via hole in a vertical direction and a thermally conductive insulation layer in a horizontal direction. CONSTITUTION: A dielectric layer(120) is formed on the lower side of a first copper layer(110). A resin layer(130) is formed on the lower side of the dielectric layer. A second copper layer(140) is formed on the lower side of the resin layer. A plating layer(150) is coated on the lower horizontal surface of the second copper layer. A dielectric via hole(160) vertically penetrates from the upper horizontal surface of the resin layer to the lower horizontal surface of the second copper layer.
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