PROCESS MONITORING APPARATUS AND PROCESS MONITORING METHOD

摘要

PURPOSE: A device and method for monitoring a process are provided to accurately measure the surface state of a probe electrode and/or the plasma change by measuring AC from plasma. CONSTITUTION: A probe substrate(420a) is mounted on a substrate holder(110). A plurality of probe electrodes(422) is arranged on one side of the probe substrate. An inner wiring(423) is arranged between the probe electrode and the probe substrate. A driving process unit(463) measures current flowing in the probe electrode. A voltage applying unit applies periodic driving voltage to the probe electrode.