发明名称 |
ASYMMETRIC FRONT / BACK SOLDER MASK |
摘要 |
A substrate including a die side interconnect pattern having a first solder mask thickness, and a board side interconnect pattern having a second solder mask thickness, where the second thickness is greater than the first thickness. Fabrication process using dry film solder mask can apply a first laminate thickness forming a die side solder mask, and a second laminate thickness forming a board side solder mask; the second thickness being greater than the first thickness. Fabrication process using a liquid solder resist can apply a first number of passes of solder resist forming a die side solder mask, and a second number of passes of solder resist forming a board side solder mask, where the board side thickness is greater than the die side thickness. |
申请公布号 |
WO2011100451(A1) |
申请公布日期 |
2011.08.18 |
申请号 |
WO2011US24377 |
申请日期 |
2011.02.10 |
申请人 |
QUALCOMM INCORPORATED;BCHIR, OMAR J.;HOLMES, JOHN P.;REYES, EDWARD |
发明人 |
BCHIR, OMAR J.;HOLMES, JOHN P.;REYES, EDWARD |
分类号 |
H01L21/48;H01L23/498 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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