发明名称 METHOD OF FABRICATING MEMORY
摘要 A method of fabricating a memory is provided. A substrate comprising a memory region and a periphery region is provided. A plurality of gates is formed on the substrate and a first spacer is formed on a sidewall of each gate, where a plurality of openings is formed between the gates in the memory region. A first material layer formed on the substrate in the memory region covers the gates in the memory region and fills the openings. A process is performed to the periphery region. The first material layer is partially removed to form a first pattern in each opening respectively. A second material layer formed on the substrate covers the memory region and the periphery region to expose the first patterns. The first patterns are removed to form a plurality of contact openings in the second material layer. The contact plugs are formed in the contact openings.
申请公布号 US2011201170(A1) 申请公布日期 2011.08.18
申请号 US20100705297 申请日期 2010.02.12
申请人 WINBOND ELECTRONICS CORP. 发明人 CHIANG LU-PING;LIAO HSIU-HAN
分类号 H01L21/336 主分类号 H01L21/336
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