| 摘要 |
PURPOSE: A printed circuit board, for including a bump pattern for aligning, and a manufacturing method thereof are provided to improve the freedom degree on the cohesive power of circuit. CONSTITUTION: Top and bump patterns(150,250) for aligning are combined in an insulating layer(270). The bond of the bump pattern for aligning is made by bonding female and male patterns of lower and upper parts. The combination of the female and male patterns is made by inserting a male pattern into a female pattern. The bump pattern for aligning is formed in order to make the circuit pattern and level difference. The circuit pattern is formed on carrier substrates(120,220). |
