发明名称 |
EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to easily and precisely connect an element and a circuit part of the PCB equipped in a substrate. CONSTITUTION: A manufacturing method of an embedded printed circuit board is as follows. A copper layer and a metal layer are formed on a copper clad laminate(210). Via bumps(240) are formed by patterning the metal layer. An adhesive layer(250) is formed on the via bumps. An element(260) is installed on the adhesive layer. An inner circuit(270) is loaded on the element. A circuit pattern is formed by removing the copper clad laminate. A via is formed through laser machining using the via bumps. The element and the circuit are electrically connected to each other by plating the via.
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申请公布号 |
KR20110093421(A) |
申请公布日期 |
2011.08.18 |
申请号 |
KR20100013463 |
申请日期 |
2010.02.12 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
LEE, MIN SEOK;CHOI, JAE BONG;LEE, KI YONG;YOO, JAE HYOUN |
分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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