发明名称 EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to easily and precisely connect an element and a circuit part of the PCB equipped in a substrate. CONSTITUTION: A manufacturing method of an embedded printed circuit board is as follows. A copper layer and a metal layer are formed on a copper clad laminate(210). Via bumps(240) are formed by patterning the metal layer. An adhesive layer(250) is formed on the via bumps. An element(260) is installed on the adhesive layer. An inner circuit(270) is loaded on the element. A circuit pattern is formed by removing the copper clad laminate. A via is formed through laser machining using the via bumps. The element and the circuit are electrically connected to each other by plating the via.
申请公布号 KR20110093421(A) 申请公布日期 2011.08.18
申请号 KR20100013463 申请日期 2010.02.12
申请人 LG INNOTEK CO., LTD. 发明人 LEE, MIN SEOK;CHOI, JAE BONG;LEE, KI YONG;YOO, JAE HYOUN
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
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