PACKAGED SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a packaged semiconductor device and a method of manufacturing the same, increasing the reliability in adhesion between a part of a resinous wiring board positioned under a bare semiconductor chip and a resin material for sealing the semiconductor chip.

SOLUTION: The packaged semiconductor device includes: the bare semiconductor chip having a functional surface and a back surface opposite to the functional surface; a metal bump disposed on the functional surface of the semiconductor chip; a wiring pattern including an electrically connecting pad in opposition to the metal bump; and the resinous wiring board having the wiring pattern as an inner wiring layer and the semiconductor chip embedded in such a way that the functional surface and the back surface of the semiconductor chip are adhered to the resin material and the resinous wiring board.

COPYRIGHT: (C)2011,JPO&INPIT