| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of producing a cured product of small thermal dimensional change. SOLUTION: This resin composition includes an epoxy resin, a polyimide resin, a curing agent, and an inorganic filler, wherein the polyimide resin has a weight average molecular weight of≤10,000. COPYRIGHT: (C)2011,JPO&INPIT
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