发明名称 PARTIALLY-MULTILAYERED FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a partially-multilayered flexible printed wiring board (partial multilayer FPC) in which only necessary parts are multilayered and on which high density surface mounting is possible. SOLUTION: In the partially multilayered flexible printed wiring board, a first double-sided FPC 52 has a double-sided circuit 53 at one end, and a double-sided circuit 55 at the other end and the center is a signal line 54 being a single-sided circuit. A second double-sided FPC 60 is layered on the double-sided circuit 53 at one end by interposing a bonding sheet 2. Inner layer side via holes 16, 24 are formed in the double-sided circuit 53 of the first double-sided FPC 52 and the second double-sided FPC 60 layered by interposing the bonding sheet 2, respectively, thereby having a structure capable of preventing a surface mounting region on the outer layer side from being narrowed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011160005(A) 申请公布日期 2011.08.18
申请号 JP20110116807 申请日期 2011.05.25
申请人 TATSUTA ELECTRIC WIRE & CABLE CO LTD 发明人 HASHIMOTO KAZUHIRO;MORIMOTO SHOHEI;KAWAKAMI TOKINORI;YAMAGUCHI NORIHIRO
分类号 H05K3/46;H05K1/11 主分类号 H05K3/46
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