| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface processing method for insulating layers and copper wiring that secures a reliability of insulation between wiring and adhesive strengths between a wiring surface and an insulating layer, and an insulating layer and an insulating layer without forming unevenness of >1,000 nm on a wiring surface, and shortens manufacturing step of a wiring board, and the wiring board processed by the surface processing method and having various superior reliabilities. SOLUTION: The surface processing method for the wiring board having insulating layers and a copper wiring formed on at least one principal surface of the insulating layer includes (I) a processing step of dissolving the insulating layer surface of the wiring board and (II) a processing step of forming unevenness on the copper wiring surface, parts of the step (I) and step (II) being carried out under the same processing conditions. COPYRIGHT: (C)2011,JPO&INPIT |
