| 摘要 |
PROBLEM TO BE SOLVED: To provide at a low cost a lead-free solder alloy enabling solder joining with high reliability though widely coping with objects to be solder-joined without containing lead. SOLUTION: The lead-free solder alloy has high solder joining characteristics with a metal electrode on glass in addition to metal materials of Cu, Ni or the like to be a material of a solder joining part of a conventional electronic part and a print substrate by using an Sn-Zn-Mn lead-free solder alloy formed of 0.01-10 wt.% of Zn,≤0.1 wt.% of Mn (not including zero as a lower limit value in the range), and a balance Sn. The solder joining characteristics with aluminum or solder joining strength is remarkably improved by adding≤3.5 wt.% of Ag (not including zero as a lower limit value in a range) and further 0.01-25 wt.% of Bi and 0.1-10 wt.% of Sb to the composition. The lead-free solder has improved solder joining characteristics of joining strength, fluidity of solder, anti-oxidizing effect or the like by totally containing 0.001-1 wt.% of at least one or more elements selected from Ni, Ge, Ga, Al and Si, so that the solder joining excellent in the solder characteristics and having the high reliability is provided. COPYRIGHT: (C)2011,JPO&INPIT |
