| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package that can improve a sealing property. SOLUTION: The semiconductor package includes: a base substance 11 made of a metal; a frame body 12 made of a dielectric, which is placed on a surface of the base substance 11 and includes an opening in its center portion; a seal member 13 which is placed on an upper surface of the frame body 12, includes an opening 21 in its center portion, has the thickness being substantially equal to that of the base substance 11, and has a coefficient of linear expansion being substantially equal to that of the base substance 11; and a lid portion 14 placed on an upper surface of the seal member 13. A desired space is made by the base substance 11, the frame body 12, the seal member 13 and the lid portion 14. COPYRIGHT: (C)2011,JPO&INPIT |
