| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for semiconductor, which is attached to a semiconductor wafer at a low temperature and has a high elastic modulus when heated, and also to provide a semiconductor device using the same. SOLUTION: An adhesive film for semiconductor contains: a polyimide resin (low-Tg polyimide resin) having a glass transition temperature (Tg) lower than the temperature of wire bonding; and a polyimide resin (high-temperature and high-elasticity polyimide resin) having the glass transition temperature higher than the temperature of wire bonding. The Tg of the low-Tg polyimide resin is preferably 80°C or below, and the Tg of the high-temperature and high-elasticity polyimide resin is preferably 190 to 230°C. A semiconductor device manufactured by using this adhesive film for semiconductor is also provided. COPYRIGHT: (C)2011,JPO&INPIT |
