摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing tool for a sapphire substrate efficiently finishing the surface roughness within 0.01 μm. <P>SOLUTION: The polishing tool for the sapphire substrate for smoothly machining the sapphire substrate 10, onto which an optical device layer is stacked, includes a base 46, and a polishing pad 47 fit on the lower surface of the base. The polishing pad is formed by sintering a mixture obtained by mixing silica particles and rubber particles. <P>COPYRIGHT: (C)2011,JPO&INPIT |