SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device uniforming temperatures at respective regions of a semiconductor element.

SOLUTION: The semiconductor device 10 includes a semiconductor element 11 and a cooler 20. A thickness d1 of an upper sidewall member 21 positioned between the semiconductor element 11 and a cooling water channel 30 is thin in a range corresponding to a center region of the semiconductor element 11 and thick in a range corresponding to a peripheral region. The center region easy to rise in temperature is efficiently cooled, so that the temperatures in the respective regions of the semiconductor element 11 get uniform.

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