| 摘要 |
PROBLEM TO BE SOLVED: To divide a wafer into chips without limiting an applicable wafer, without a problem of alignment after dividing, and without requiring a device other than a dicing device, while suppressing occurrence of chipping, burr, contamination and the like in a dicing process of the wafer. SOLUTION: A method of manufacturing chips by dividing a wafer 1 into a plurality of chips 8 includes: a first step of adhering an adhesive layer of a protective tape 2 having the adhesive layer on at least one side thereof to the wafer 1; a second step of performing half-cut dicing on the wafer 1; a third step of adhering an adhesive layer of a protective tape 6 having the adhesive layer on at least one side thereof to the half-cut surface of the wafer 1 half-cut in the second step; a fourth step of removing the protective tape 2 adhered in the first step; and a fifth step of dividing the wafer 1 into the plurality of chips 8 by performing the half-cut dicing on a surface on an opposite side from the half-cut surface. COPYRIGHT: (C)2011,JPO&INPIT |
