发明名称 |
Light-Emitting Devices with Through-Substrate Via Connections |
摘要 |
Multiple through-substrate vias (TSVs) are used to make electrical connections for an LED formed over a substrate. A first TSV extends through the substrate from a back surface of the substrate to the front surface of the substrate and includes a first TSV conductor that electrically connects to a first cladding layer of the LED. A second TSV extends through the substrate and an active layer of the LED from the back surface of the substrate to a second cladding layer or an ITO layer. The second TSV includes an isolation layer that electrically isolates a second TSV conductor from the first cladding layer and the active layer. Additionally dummy TSVs may be formed to conduct heat away from the LED optionally through a package substrate.
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申请公布号 |
US2011198609(A1) |
申请公布日期 |
2011.08.18 |
申请号 |
US20100704974 |
申请日期 |
2010.02.12 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG HSIN-CHIEH |
分类号 |
H01L33/30;H01L33/00;H01L33/48;H01L33/62 |
主分类号 |
H01L33/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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