UNDERLAYER FILM MATERIAL, AND METHOD FOR FORMATION OF MULTILAYER RESIST PATTERN

摘要

Disclosed are: an underlayer film material for use in the formation of a resist underlayer film, which is highly soluble in safe solvents, has excellent etching resistance, and does not substantially cause the production of any sublimation product; and a resist pattern formation method using the underlayer film material. Specifically disclosed are: an underlayer film material comprising a cyclic compound that can have two or more specific structures; and a resist pattern formation method using the underlayer film material.