| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tool for a semiconductor wafer and a method of processing a semiconductor wafer, which improve the strength of the semiconductor wafer and achieve reduction of facilities and cost. <P>SOLUTION: The tool provides a semiconductor wafer 1 with rigidity. A rigidity securing ring 2 having heat resistance is adhered to the periphery of the back-ground thin semiconductor wafer 1. The adhesion of the rigidity securing ring 2 to the periphery of the back-ground thin semiconductor wafer 1 increases the strength of the semiconductor wafer 1, thereby eliminating the need for back-grinding the inner region of the semiconductor wafer 1 while leaving the periphery of the semiconductor wafer 1. Thus, a device of dedicated use is eliminated and the facilities and the cost are reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
