发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which can make signal wiring satisfactorily transmit a high-speed signal exceeding, for example, 2.5 GHz with low loss, and can satisfactorily supply power supply. <P>SOLUTION: The wiring board is constituted by laminating build-up wiring layers 3 including signal wiring, ground wiring and power source wiring on the upper and lower surfaces of a core substrate 1 having many through holes 5 at an outer peripheral part and a center part, with build-up insulating layers 2 interposed. In the wiring board, small-diameter through-holes 5S are arrayed at the outer peripheral part at first adjacent intervals and large-diameter through-holes 5L are arranged at the center part at second adjacent intervals smaller than the first adjacent intervals, and the signal wiring is connected to the small-diameter through-holes 5S and the ground wiring and power source wiring are connected to the large-diameter through-holes 5L. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011159734(A) 申请公布日期 2011.08.18
申请号 JP20100019109 申请日期 2010.01.29
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 ABE SEIICHI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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