| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having low connection resistance and high electrical reliability using an interlayer connection structure of conductive paste, and to provide a method for manufacturing the board. SOLUTION: The land portion 22a of the other metal foil laminated by an adhesive layer 14 to sandwich a substrate 11 faces the land portion 12a of one metal foil 12, which is stuck in advance to the substrate 11 of an insulating polyimide resin film. The substrate 11 consists of a material which is not readily fluidized by hot pressing, when it is stuck to the land portion 22a of the other metal foil. The thickness of a substrate portion 17 between the land portions 20a and 22a, i.e., the interval from the surface of the substrate 11 to the land portion 12a of one metal foil 12, is set equal to 35-50% of the thickness of an insulation layer 18 constituted of the substrate portion 17 and the adhesive layer 14, when the thickness of the substrate portion 17 is less than or equal with respect to the thickness of the adhesive layer 14. When the thickness of the substrate portion 17 is larger than that of the adhesive layer 14, the thickness of the substrate portion 17 is set equal to 65-90% of the thickness of the insulation layer 18. COPYRIGHT: (C)2011,JPO&INPIT |
