发明名称 SUBSTRATE HOLDING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a substrate holding tool ensuring easy removal of a substrate from an adhesive layer, imparting heat resistance, and simplifying the structure. SOLUTION: The substrate holding tool 1 holds a thin semiconductor wafer W on a laminate holder 2 of approximately the same size as the semiconductor wafer W. The laminate holder 2 has a layered structure of a plurality of rigid base layers 3 and a plurality of self-adhesive layers 4 detachably laminated on the base layers 3 to be adherable to the semiconductor wafer W. The self-adhesive layers 4 are located on the top surface of the laminate holder 2, and the base layers 3 are located on the back surface of the laminate holder 2. The plurality of base layers 3 and the plurality of self-adhesive layers 4 are both made flexible and impart the heat resistance. Since the multilayer structure of the plurality of base layers 3 and the plurality of self-adhesive layers 4 provides the laminate holder 2 with sufficient tensile strength, it is convenient to handle and transfer the semiconductor wafer W. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011159804(A) 申请公布日期 2011.08.18
申请号 JP20100020284 申请日期 2010.02.01
申请人 SHIN ETSU POLYMER CO LTD 发明人 ODAJIMA SATOSHI
分类号 H01L21/02;H01L21/673 主分类号 H01L21/02
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