| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing agent for an epoxy resin with a difference in ability to cure the epoxy resin between a low-temperature region of around 80°C and a high temperature region of around 150°C, which can selectively perform a curing reaction of the epoxy resin in the high temperature region of around 150°C. SOLUTION: The curing agent for an epoxy resin comprises an imidazole-based compound (A) represented by formula (1). R1 to R3 represent a hydrogen atom, a 1-10C alkyl group, or a phenyl group; R4 to R6 represent a 1-5C alkyl group or phenyl group; X is O, S, CH<SB>2</SB>, and NH; and n is an integer of 1-5. COPYRIGHT: (C)2011,JPO&INPIT
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