| 摘要 |
A circuit substrate includes a first pair of ground lines, a second pair of ground lines, a plurality of first connection lines, a plurality of second connection lines and a plurality of conductive pillars. The first and second pairs of ground lines are located on first and second surfaces of the substrate, respecteively. The pillars are located in the substrate and vertically conducted between the first pair of ground lines and the second connection lines and between the second pair of ground lines and the first connection lines, and the first and second pairs of ground lines are conducted, so that a 3-D grounding circuit loop is formed. Moreover, a first pair of signal lines is disposed between the first connection lines for grounding and a second pair of signal lines is disposed between the second connection lines for grounding to get a better signal integrity.
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