Arrangement for producing electrical conductive connection between printed circuit board and semiconductor module i.e. LED module, of circuit configuration, has contact surface and contact counter surface supported in physical attachment

摘要

The arrangement (1) has a plate-type pressure component (28a) including a hold-down device (38) corresponding to a contact surface (16) and a contact counter surface (18) of a printed circuit board (2) and a semiconductor module i.e. LED module. The hold-down device is hinged to the component in a cantilever-manner, and the contact surface and the contact counter surface are supported in a direct physical attachment by the pressure component, where the contact surface is in contact with the corresponding contact counter surface. The semiconductor module is arranged on a carrier substrate (12).