| 摘要 |
PURPOSE: A light emitting device, a manufacturing method thereof, and a light emitting device package are provided to improve the current spreading of the light emitting device by forming a current blocking layer made of light transmitting materials to be overlapped with a part of an electrode. CONSTITUTION: A light emitting structure(145) comprises a first conductive semiconductor layer(130), an active layer(140), and a second conductive semiconductor layer(150). An electrode(170) is formed on the first conductive semiconductor layer. A current blocking layer(158) is formed under the second conductive semiconductor layer. An ohmic pattern layer(155) is formed under the second conductive semiconductor layer and forms an ohmic contact with the second conductive semiconductor layer. A reflection layer(156) is formed under the light emitting structure, the current blocking layer, and the ohmic pattern layer. |
