| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package that is easy to handle, a method for manufacturing the LED package, and a packaging material for the LED package. <P>SOLUTION: The LED package 1 is provided with: mutually isolated lead frames 11 and 12; an LED chip 14 provided above the lead frames 11 and 12 and having one terminal 14a connected to the lead frame 11 and the other terminal 14b connected to the lead frame 12; and a transparent resin body 17 in which the lead frames 11 and 12 and the LED chip 14 are embedded. Then the upper surface of the transparent resin body 17 has surface roughness of ≥0.15 μm. <P>COPYRIGHT: (C)2011,JPO&INPIT |
