| 发明名称 |
Solder resist composition and printed circuit boards |
| 摘要 |
<p>The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits (5) and a solder resist layer (14) formed on a surface of the Substrate, in which a roughened layer (11) is formed on a surface of the conductor circuit (5).</p> |
| 申请公布号 |
EP0844809(B1) |
申请公布日期 |
2011.08.17 |
| 申请号 |
EP19970116093 |
申请日期 |
1997.09.16 |
| 申请人 |
IBIDEN CO, LTD. |
发明人 |
ONO, YOSHITAKA;GOTO, AKIHIKO;NIKI, AYAO;ASAI, MOTOO |
| 分类号 |
G03F7/004;H05K3/28;G03F7/032;G03F7/038;H05K1/11;H05K3/18;H05K3/24;H05K3/34;H05K3/38;H05K3/40;H05K3/46 |
主分类号 |
G03F7/004 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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