| 摘要 |
PURPOSE: A method for manufacturing a semiconductor device is provided to form an electrode pad or wiring cross a step without disconnection by uniformly forming a Pd layer on the surface of a semiconductor substrate. CONSTITUTION: A semiconductor substrate(16) is immersed in Pd activating solutions with Pd ions. The Pd activating solutions are chloride palladium solutions. A Pd catalyst(30) is attached to the surface of the semiconductor substrate. The semiconductor substrate is immersed in a Pd electroless plating solutions(40). A Pd electroless plating layer(44) is formed on the semiconductor substrate.
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