Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device

摘要

Use of an adhesive composition for a circuit-connecting material for electrical connection between opposing circuit electrodes, wherein the adhesive composition comprises: a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000; wherein the urethane (meth)acrylate includes a urethane (meth)acrylate with a divalent organic group in the molecule represented by the formula (B) and/or the general formula (C) disclosed herein;
and at least one group selected from the group consisting of divalent organic groups represented by the general formulas (D), (E) and (F) disclosed herein wherein R 5 and R 6 respectively represent hydrogen and methyl or methyl and hydrogen and wherein 1, m and n each represent an integer of 2-60. The invention also provides the circuit-connecting material and semiconductor device each comprising said adhesive composition; and a process for the production of a circuit member connection structure.