Sputtering apparatus and sputtering method

摘要

A film having excellent uniformity in in-plane distribution of film thickness or sheet resistance is formed, in the case of forming a magnetic field on a processing surface of a substrate (21) and formmg a magnetic film by oblique incidence sputtering by using high discharge power. A sputtering apparatus (1) is provided with: a substrate holder (22) which rotatably holds the substrate (21) in the surface direction of the substrate surface to be processed; a substrate magnetic field forming apparatus (30), which is arranged on the circumference of the substrate (21) and forms a magnetic field on the substrate (21) surface to be processed; a cathode (41) which is arranged diagonally above the substrate (21) and is supplied with discharge power; a position detecting apparatus (23) which detects the rotating position of the substrate (21); and a control apparatus (50) which adjusts the rotating speed of the substrate (21) in accordance with the rotating position detected by the position detecting apparatus (23).